昆山市宏嘉焊锡制造有限公司
Flex-Cored Type 所含助焊剂型号 | |
Flex-Cored Type 所含助焊剂型号 |
Grade 等级 |
HJ#1 | Water Soluble type 有机水溶性型 |
HJ#2/HJ#3/H1021 | No Clean type 免洗型 |
HJ#529/607 | RA type 活性松香型 |
HJ#6 | Halide Free No Clean type 无卤化物免洗型 |
Flex-Cored Type 所含助焊剂型号 |
Features 特性 |
Cleaning Methods 清洗方式 |
||||
HJ#1 |
Water-soluble cored -flux for aqueous cleaning assemblies process.Excellent “Fast action"wetting property to enhance productivity. 水溶性,适合于水洗工序,润湿快,可以大大提高生产效率。 |
Water Clear 水洗 |
||||
HJ#2/ HJ#3/ HJ#1021 |
Lowest and clear flux residue suited for most commercial no-clean hand soldring assemblies. Widely and most popular choice for assemblies requiring no-clean, clear residue characteristice. 无色透明,免洗,极少残留物,适合于经济型的免洗手工焊接工序,是需要免洗和干净残留物的电子装配商的最佳选择。 |
No Clear 免洗 |
||||
HJ#529 |
Fast wetting action RA cored-flux for consumer electronics assemblies. Flux residue is not corrosive nor conductive under normal condition of use.Cleaning not necessary for most consumer assmblies. 润湿快,活性强,适合于消费性电子组装行业,在普通使用条件下助焊剂残留物无腐蚀,不导电,大多数消费性电子组装行业的使用者可免洗残余物。 |
Bi-polar solvents 两极性溶剂 |
||||
HJ#607 |
Halide free with lowest and clear flux residue suited for no-cleanhand soldering assemblies. Exhibit fast wetting characteristics.Widely and most popular choice for assemblies requiring no-clean,clear residue characteristics.Suitable for use on different alloys. 无卤化物,极少残留物,适合于免洗手工焊接组装。展现出快速湿润物性。免性,低残留物的物性使其成为广泛和最受欢迎的选择。适合于多种不同合金。 |
No Clear 免洗 |
Characteristic of Cored flux 焊芯焊线的特性
Properties | HJ#1 |
HJ#2/ HJ#3/ HJ#1021 |
HJ#529 | HJ#6 | Test Method |
Flux type 助焊剂类型 |
Water Soluble |
RMA No Clean |
RMA No Clean |
RMA No Clean |
_ |
Class type*1 等级类型 |
ORH1 | ROL1 | ROL1 | ROL0 | _ |
Halide Content (Mass %) 卤化物含量(%) |
≤2.000 | ≤0.100 | ≤0.440 | 0.00 |
JIS Z3197 8.1.4.2.1 |
Corrosion Test 腐蚀测试 |
NA | Pass | Pass | Pass |
J-STD-004 IPC-TM-650 2.3.13 |
Acid Value 酸值 |
NA |
190-210 Mg KOH/g |
190-210 Mg KOH/g |
208-228 Mg KOH/g |
J-STD-004 IPC-TM-650 2.3.13 |
SurfaceInsulation Resistance*2SlR(Ω) 表面绝缘阻抗 |
≥1x109Ω After Cleaning |
≥1x109Ω | ≥1x109Ω | ≥1x1011Ω |
J-STD-004 IPC-TM-650 2.6.3.3 |
Spread Factor(%) 扩散率 |
≥85 | ≥82 | ≥83 | ≥80 |
JISZ3197 8.3.1.1 |
表面电阻系数:测试条件:85±2℃,85±2%;条件编差:+50V:测量法偏差:+100V
Fluxcontent 助焊剂含量
1.0%~3.3%(Depends on application and diameter)视用途和线径而定。
Diameter available 适用线径
0.10mm~4.0mm(According to customer's requirement)依照客户要求。
Packaging 包装
Diameter(mm) 线径 |
Net weight per spool (kg) 一卷净重 |
No.spool per box 一盒卷数 |
Net weight per box (Kg) 一盒净重 |
60.8-2.0 | 1 | 10 spool | 10.00 |
0.5-0.7 | 0.5 | 10 spool | 5 |
0.4 | 0.25 | 10 spool | 2.5 |
0.3 | 0.25 | 10 spool | 2.5 |
0.2 | 0.25 | 10 spool | 2.5 |
Products 产品 |
Melting Point 熔点(℃) |
Shear Strength 剪切强度 (Mpa) |
Tensile Strength 抗拉强度(Mpa) |
Thermal Expansion Coefficient 热膨胀系数 (10-6/K) |
Elongation 延伸率(%) |
As-Cast 铸态 |
Spreading Area 铺展面积Cu (mm2/0.2mg) |
Appearance 焊点外观 |
|
Proceeded 加工态 |
As-Cast 铸态 |
Proceeded 加工态 |
|||||||
SnBi58 | 139 | 48 | 48 | 48 | 15 | 46 | 54.3 | 60.5 | 光亮 |
SnBiCu1# | 149-186 | 37.9 | 37.9 | 37.9 | 19.5 | 20 | 12.5 | 69.8 | 消光 |
SnBiCu2# | 180-209 | 49 | 49 | 49 | 19 | 20 | 12.3 | 70.4 | 均匀、消光 |