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昆山市宏嘉焊锡制造有限公司
联系人:杨先生
号   码:13913208598
联系人:瞿先生
号   码:18626170799
电   话:0512 -55165088 55165069
传   真:0512-55165075
邮   箱:hjsolder @vip.163.com
网   址:www.hj- solder.cn
地   址:昆山市开发区蓬朗洪湖路10号

无铅锡丝系列

  • 所属分类:无铅锡丝系列
  • 浏览次数:62次
  • 发布日期:2025/3/4 16:15:48
  • 概述
Flex-Cored Type 所含助焊剂型号
Flex-Cored Type
所含助焊剂型号
Grade
等级
HJ#1 Water Soluble type 有机水溶性型
HJ#2/HJ#3/H1021 No Clean type 免洗型
HJ#529/607 RA type 活性松香型
HJ#6 Halide Free No Clean type 无卤化物免洗型

Flex-Cored Type

所含助焊剂型号
Features

特性
Cleaning Methods

清洗方式
HJ#1 Water-soluble cored -flux for aqueous cleaning assemblies process.Excellent “Fast action"wetting property to enhance productivity.

水溶性,适合于水洗工序,润湿快,可以大大提高生产效率。
Water Clear

水洗
HJ#2/
HJ#3/
HJ#1021
Lowest and clear flux residue suited for most commercial no-clean hand soldring assemblies. Widely and most popular choice for assemblies requiring no-clean, clear residue characteristice.

无色透明,免洗,极少残留物,适合于经济型的免洗手工焊接工序,是需要免洗和干净残留物的电子装配商的最佳选择。
No Clear

免洗
HJ#529 Fast wetting action RA cored-flux for consumer electronics assemblies. Flux residue is not corrosive nor conductive under normal condition of use.Cleaning not necessary for most consumer assmblies.

润湿快,活性强,适合于消费性电子组装行业,在普通使用条件下助焊剂残留物无腐蚀,不导电,大多数消费性电子组装行业的使用者可免洗残余物。
Bi-polar solvents

两极性溶剂
HJ#607 Halide free with lowest and clear flux residue suited for no-cleanhand soldering assemblies. Exhibit fast wetting characteristics.Widely and most popular choice for assemblies requiring no-clean,clear residue characteristics.Suitable for use on different alloys.

无卤化物,极少残留物,适合于免洗手工焊接组装。展现出快速湿润物性。免性,低残留物的物性使其成为广泛和最受欢迎的选择。适合于多种不同合金。
No Clear

免洗


Characteristic of Cored flux   焊芯焊线的特性

Properties HJ#1 HJ#2/
HJ#3/
HJ#1021
HJ#529 HJ#6 Test Method
Flux type
助焊剂类型
Water Soluble RMA
No Clean
RMA
No Clean
RMA
No Clean
_
Class type*1
等级类型
ORH1 ROL1 ROL1 ROL0 _
Halide Content
(Mass %)
卤化物含量(%)
≤2.000 ≤0.100 ≤0.440 0.00 JIS Z3197
8.1.4.2.1
Corrosion Test
腐蚀测试
NA Pass Pass Pass J-STD-004
IPC-TM-650
2.3.13
Acid Value
酸值
NA 190-210
Mg KOH/g
190-210
Mg KOH/g
208-228
Mg KOH/g
J-STD-004
IPC-TM-650
2.3.13
SurfaceInsulation
Resistance*2SlR(Ω)
表面绝缘阻抗
≥1x109Ω
After Cleaning
≥1x109Ω ≥1x109Ω ≥1x1011Ω J-STD-004
IPC-TM-650
2.6.3.3
Spread Factor(%)
扩散率
≥85 ≥82 ≥83 ≥80 JISZ3197
8.3.1.1
*1 Class type (Halide content in Rosin Base Flux) according to the J-STD-004:ROL1=<0.5%
等级类型(松香焊剂的卤化物成份)依照J-std-004:ROL0=0.0%,ROL1=<0.5%
*2 Surface lnsulation Resistance:Test Condition:85±2℃,85±2%; Conditioning Bias:+50V: Measurement Bias:+100V

表面电阻系数:测试条件:85±2℃,85±2%;条件编差:+50V:测量法偏差:+100V

Fluxcontent 助焊剂含量
1.0%~3.3%(Depends on application and diameter)视用途和线径而定。

Diameter available 适用线径
0.10mm~4.0mm(According to customer's requirement)依照客户要求。

Packaging 包装

Diameter(mm)
线径
Net weight per spool (kg)
一卷净重
No.spool per box
一盒卷数
Net weight per box (Kg)
一盒净重
60.8-2.0 1 10 spool 10.00 
0.5-0.7 0.5 10 spool 5
0.4 0.25 10 spool 2.5
0.3 0.25 10 spool 2.5
0.2 0.25 10 spool 2.5


Shelflife 有效期限
24 months from the date of manufacturing.
自生产日期开始二十四个月内。

Storage 贮存
To minimize the wires from further oxidation, ensure that the packaging is not damaged &the wires are not exposedto dust & other foreign materials.
为了减少锡钱受到氧化,确保包装不破损,锡线不曝露于灰尘和其他物质。

Delivery 交货
Each order can be shipped with the certificate of analysis for each lot.
交货同时附上分析证明书。

MaterialSafety DataSheet 材料安全数据单
A MSDS for this product can be request from our Sales personnel.
产品的MSDS可向销售部索限。

Technical & Customer Service Support 技术&客户服务
For more information our Lead free wires as well as our other products, please call, fax or email us. Our salesEngineers will be most glad to answer your enquires as well as recommend the most suitable product for yourapplication. Our Customer Service personnel are also available to provide you with our competitive quotation quotation as well as expedite your orders & provide you with any assistance you may require.
欲知无铅锡线或我们其他的产品,请用电话、传真或电邮给我们。我们的销售工程师将很乐意的给予解答和介绍最适合您的用途的产品。我们的销售工程师会提供您具竞争力的服价,并尽快的交货和提供您所需的协助。

Ultrafine Solder Wires 超细锡丝

Solder wires of different alloy with diameter varying from 0.1mm to 0.3mm are all available.
我公司可提供各种合金的Φ0.1mm-Φ0.3mm超细锡丝。

Ultra Low-Melting SolderWires 超低温锡丝

Ultra low-melting wires such as BiPbSnln wire (melting point 87-94℃) and BiPblnSnCd wire (melting point 54-56℃) are considered to be the optimal choices for making fire detectors and alarms.
我公司超低温锡丝适用于火灾探测器、温度报警器等行业,主要有BiPbSnin和BiPbinSnCd等产品,其中BiPbSnIn熔点87-94℃,BiPbInSnCd熔点54-56℃。

High-Melting Lead-FreeSolderWires 无铅高温锡丝
Sn-Sb系 Sn-Sb Series
SnSb5 and SnSb10 wires, with melting point 245℃ and 245-255℃ respectively and working temperature from370℃ to 430℃, are widely used in the soldering of passive elements and small-scale IC, and will effectively help creating a solder joint with high reliability, good high-temperature strength and excellent corrosion resistance, thussuitable for the secondary package.
Sn-Sb 系锡丝主要有SnSb5、SnSb10,熔点分别为245℃、245-255℃,建议焊接温度为370-430℃,主要应用于被动元件与小型集成电路的焊接。焊后焊点可靠性好、高温强度高,抗腐蚀性能好,满足二级封装的焊接温度要求。

Lead-freebelt无铅锡带
SnAaCu Fasten with basically has thickness of tin 0.05-0.15, are widely used in the soldering of passive elementsand small-scalelC.
SnAgCu系锡带主要有厚度为0.05-0.15,主要应用于被动元件与小型集成电路的焊接。

SpecialSolderWires 特种锡丝
Parameters 产品参数
Products
 产品
Melting Point
熔点(℃)
Shear Strength
剪切强度
(Mpa)
Tensile Strength
抗拉强度(Mpa)
Thermal Expansion
Coefficient
热膨胀系数
(10-6/K)
Elongation
延伸率(%)
As-Cast
铸态
Spreading Area
铺展面积Cu
(mm2/0.2mg)
Appearance
焊点外观
Proceeded
加工态
As-Cast
铸态
Proceeded
加工态
SnBi58 139 48 48 48 15 46 54.3 60.5 光亮
SnBiCu1# 149-186 37.9 37.9 37.9 19.5 20 12.5 69.8 消光
SnBiCu2# 180-209 49 49 49 19 20 12.3 70.4 均匀、消光

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